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THERM CURE™ 4050
Thermally Conductive Adhesive –
High Temperature Application
- SNAP CURE
- HIGH THERMAL CONDUCTIVITY
- HIGH TEMPERATURE
- SOLVENT RESISTANT
- EXCELLENT ADHESION
- ONE COMPONENT SYSTEM
- NON-TOXIC
- 100% SOLIDS
Therm Cure 4050 is a one-component adhesive designed for applications requiring high thermal conductance (5.3W/m-K). It is an aluminum nitride filled epoxy with unmatched thermal conductivity.
The Therm Cure 4050 thermally conductive adhesive is used to attach components with large areas or thermal mismatches and as an electrically insulating adhesive suitable for die bonding or heat sink attachment.
Application of this thermal adhesive is performed by either dispense or screen-print methods.
Plating, flux and atmosphere requirements of solder attach are eliminated when this adhesive replace solder. Typically, this adhesive is used as a heat sink to bond metals, ceramics, glass and many plastics.
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