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LITE FAST 2012

 

UV Encapsulant - Electronic Components

 

  • MOISTURE RESISTANT
  • BROAD OPERATING TEMPERATURES
  • EASY APPLICATION
  • RAPID UV CURE
  • SNAP HEAT CURE
  • ONE COMPONENT SYSTEM
  • NO OUTGASSING
  • PIGMENTED
  • 100% SOLID SYSTEMS
Lite Fast 2012 resin system is a UV cure, high temperature, encapsulant designed as a protective dielectric on chip resistors and electronic components. The UV encapsulant eliminates pinholes, orange peel, or voids when coating capacitors, resistors, delay lines, networks and rectifiers.

This UV encapsulant exhibits low shrinkage, high tensile and compression strength with a broad operating temperature range from -45 to 175 C.

The pigmented resin is applied by roll coating over the component and then exposed to UV light.  Cure is reached within 10 seconds using a 300-watt per inch H bulb or iron doped UV lamp. A post heat treatment is necessary for complete cure. The recommended temperature is 130 C for 20 minutes.

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for Lite Fast 2012 UV Encapsulant


 
 
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