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LITE FAST™ 2081
Low Viscosity UV Encapsulant - Toroidal Coils and Pre-Molding Applications
- LOW VISCOSITY
- SOFT - FLEXIBLE
- LOW DIELECTRIC CONSTANT
- RAPID UV CURE
- MOISTURE RESISTANT
- IONIC PURITY
The Lite Fast 2081 UV encapsulant was specifically developed to relieve the stress placed on toroidal coils or electrical components that will experience pressure during the molding process.
Ionic purity is critical to high frequency components. Ionic impurity is measured at <1ppm. This UV encapsulant also meets RoHS compliance. There is no ionic contamination when using this UV cure encapsulant.
Equally important is the low dielectric constant of 2.1 that makes Lite Fast 2081 ideal for high frequency applications. The lower the dielectric constant the less interference from adjacent conductive paths and a more uniform magnetic inductance required for toroids after they are molded.
Click here for FULL PRODUCT BULLETIN
for Lite Fast 2081 UV Low Dielectric Encapsulant
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