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THERM CURE™ 4021

Thin Bond Line Applications

  • ROOM TEMPERATURE CURE 
  • SOLVENT  RESISTANT
  • EXCELLENT ADHESION 
  • TWO COMPONENT
  • GENERAL PURPOSE EPOXY 
  • SINGLE CARTRIDGE SYRINGE

Therm Cure 4021 is a general purpose, room temperature cure epoxy adhesive and sealant that guarantees excellent adhesion to a variety of substrates and is used where strong, tough system is required.  

Therm Cure 4021 is a non-thixotropic, low viscosity, two-component system used as a thin bond line adhesive to various substrates.

Mix ratio is a simple 1:1 by volume or 100 gm: 80.0 gm for Part A and Part B respectively.  Application of this adhesive is performed by dispensing onto the substrate.

MLT will supply the material to fit the Customer's packaging requirements.

Click here for FULL PRODUCT BULLETIN
for Therm Cure 4021 Thin Bond Line Applications 


 
 
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